Mass-producing and supplying units to validate ‘Rubin’ “Demand expected to surge when Rubin launches next year”
SK hynix has been confirmed to be supplying NVIDIA with “HBM4,” its 6th-generation high-bandwidth memory (HBM), for a fee to produce samples of the next-generation artificial intelligence (AI) semiconductor “Rubin.” According to the semiconductor industry on the 15th, SK hynix is currently supplying NVIDIA with HBM4 in a volume of between 20,000 and 30,000 units. This volume is reported to be for performance testing and verification of Rubin, NVIDIA’s next-generation AI chip under development.
NVIDIA is conducting performance tuning with global Big Tech customers ahead of the Rubin launch. HBM4, the next-generation HBM, is required to operate Rubin, and SK hynix is supplying it for this purpose.
The semiconductor industry expects demand for HBM4 to surge sharply in line with the timing of NVIDIA’s Rubin launch. An industry official said, “During the process of conducting performance tests with its customers, NVIDIA is understood to be requesting HBM4 manufacturers such as SK hynix and Samsung Electronics to supplement detailed specifications,” adding, “With the possibility being raised that Rubin could be released as early as early next year, domestic HBM manufacturers may enter a full-fledged benefit phase.”
SK hynix has already established a mass production system for HBM4 and has begun production. The company completed preparations for HBM4 mass production in September this year and stated in its earnings announcement for the third quarter (July–September), “HBM4 has been prepared to fully meet customer-required performance and support the highest speed levels in the industry.” It added, “We plan to begin shipments from the fourth quarter (October–December) and to significantly expand sales next year.”
Samsung Electronics has likewise established a mass production system for HBM4. Like SK hynix, it is reported to be supplying NVIDIA with HBM4 for Rubin testing. With competition in next-generation AI semiconductors entering a full-fledged phase, the industry expects the battle for leadership among memory companies over HBM4 to become even more intense.
Lee Dong-hoon
AI-translated with ChatGPT. Provided as is; original Korean text prevails.
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