LG Electronics is collaborating with global data center infrastructure company Flex to develop next-generation modular data center cooling solutions.

On the 4th, LG Electronics announced that it recently signed a memorandum of understanding (MOU) with Flex for the joint development of modular cooling solutions. The strategy is to develop cooling technology that addresses the heat generation issues of artificial intelligence (AI) data centers and enables rapid deployment.

Flex is a company with capabilities in product design, manufacturing, and supply chain management across various industries, including data centers, automotive, and healthcare. The plan is to develop an integrated system combining LG Electronics' high-efficiency cooling products, such as chillers, coolant distribution units (CDU), and computer room air handling units (CRAH), with Flex's information technology (IT) and power infrastructure.

The products they are developing will be manufactured in the form of pre-assembled and tested cooling modules that can be combined with other modules on-site. They can be customized according to customer requirements and allow for quick installation. Additionally, cooling modules can be easily expanded as needed, maximizing the scalability and flexibility of data centers.

Jae-sung Lee, Head of LG Electronics' ES Business Division, stated, "This collaboration will be a strategic opportunity to strengthen LG Electronics' position in the AI data center market." Michael Hartung, President of Flex, said, "We will provide the optimal solution to solve the heat issues of data centers together with LG Electronics."

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