At the Semiconductor Grand Exhibition... AI Memory Clash "6th Generation HBM Market Competition Begins"
On the 22nd, visitors to the 27th Semiconductor Exhibition (SEDEX 2025) held at COEX in Gangnam-gu, Seoul, examine the high-bandwidth memory HBM4 from SK Hynix (top photo) and Samsung Electronics. This is the first time the HBM4 has been publicly displayed. News1·Newsis
Samsung Electronics and SK Hynix have unveiled the next-generation high-bandwidth memory (HBM) 'HBM4' for the first time in Korea. This marks the beginning of competition in the 6th generation HBM market, according to analysts.
On the 22nd, Samsung Electronics and SK Hynix showcased the HBM4 at the 'SEDEX 2025 (Semiconductor Exhibition)', the largest semiconductor exhibition in Korea, held at COEX in Gangnam-gu, Seoul. This is the first public display of the HBM4, attracting a large number of visitors eager to see the HBM4 at the companies' exhibition booths.
HBM4 is the next-generation product following the currently supplied 5th generation HBM3E. With global AI semiconductor leader NVIDIA planning to equip its new AI semiconductor, Rubin, with HBM4 starting next year, HBM4 is expected to become a new battleground. Market research firm Omdia stated, "The supply capability of HBM4 is expected to emerge as a key differentiating factor in the future semiconductor market." TrendForce also predicted that HBM4 will overtake HBM3E and become mainstream from the second half of next year (July to December).
Given the significant impact of the rapidly rising AI market on the performance of semiconductor companies, both Samsung Electronics and SK Hynix are betting heavily on HBM4. Both companies have completed the development of HBM4 and established mass production systems, with expectations that the results of performance tests by customers such as NVIDIA could lead to differing fortunes by the end of this year.
Samsung Electronics, which fell behind in the HBM3E competition, plans to make a comeback with HBM4. The company has taken a bold step by developing HBM4 using a 1c nanometer process, which is a generation ahead of its competitors. SK Hynix, riding the momentum of achieving a record quarterly operating profit of KRW 10 trillion through HBM3E, plans to dominate HBM4 as well. SK Hynix demonstrated its confidence by setting up a dedicated exhibition space for HBM4 at this exhibition.
In addition to HBM, both companies drew attention by exhibiting a large number of AI memory products, including GDDR7, DDR5, and high-density memory module SOCAM, at this exhibition.
Lee Dong-hoon
AI-translated with ChatGPT. Provided as is; original Korean text prevails.
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