LG Innotek announced on the 10th that it has developed a next-generation smart integrated circuit (IC) substrate that delivers high performance without a precious metal plating process. This is the first time a substrate that does not require plating has been introduced.

A smart IC substrate is the metallic grid section found in credit cards, electronic passports, and USIMs, and is an essential component used when mounting an IC chip that contains personal security information. When a user touches a smart card to an automated teller machine (ATM) or passport reader, it transmits the IC chip’s information to the reader through electrical signals.

Previously, a plating process using precious metals such as palladium and gold (Au) on the substrate surface was essential to prevent corrosion and ensure stable transmission of electrical signals. However, these two metals pose issues, as large amounts of greenhouse gases are generated during the mining process and their prices are high.

LG Innotek developed a new material that enables high performance without a precious metal plating process and applied it to this product for the first time worldwide. By eliminating the plating process, this new material can reduce carbon emissions by about 50% while enhancing durability to approximately three times that of existing products. LG Innotek has secured around 20 related domestic patents and is pursuing patent registrations in the United States, Europe, and China. The next-generation smart IC substrate developed by LG Innotek will be supplied to global smart card manufacturers.

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