South Korean artificial intelligence (AI) semiconductor design (fabless) startup DeepX has secured 27 purchase orders just seven months after beginning mass production of its ultra-low-power AI chip “DX-M1.”

On the 29th, DeepX stated, “We have secured a total of 27 purchase orders from companies in eight countries within seven months of launching the mass-produced DX-M1 in August last year.” DeepX explained that 25 of these orders were received between January and March this year. While there were only two purchase orders between August and December last year, orders increased significantly after the company disclosed the chip’s performance at CES 2026, the world’s largest information technology (IT) and home appliance exhibition, in January this year.

At CES 2026, DeepX highlighted the performance of its product through a “butter benchmark.” According to the company, its heat control performance is so outstanding that butter, which melts at 30–36 degrees Celsius, placed on a running AI chip does not melt. DeepX said, “The power required to operate the chip is only 5 watts (W), and there is no need to attach a separate cooling device to control heat,” adding, “It is optimized for ‘physical AI,’ where AI computation must be processed inside the device.”

DeepX said its AI chips are being supplied to the physical AI markets in the United States, Europe, China, Japan, Singapore, and other regions. DeepX is pushing ahead with mass production of “Edge Brain,” an on-device AI chip for robots jointly developed with Hyundai Motor Group, and is also working with Chinese company Baidu with the goal of installing DeepX chips in robots, drones, and factory automation equipment.

DeepX will also unveil “DX-M2,” the successor to the DX-M1, within this year. A DeepX official said, “It is a product that uses Samsung Electronics’ 2-nanometer (nanometer; 1 nm is one-billionth of a meter) foundry (semiconductor contract manufacturing) process, and we plan to provide samples to customers within this year.”

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