LG Electronics has unveiled for the first time a modular solution for AI data center cooling equipment that is pre-assembled at the factory and supplied as a unit. The company aims to expand its business scope beyond the supply of cooling equipment to become an “AI infrastructure partner” that supports the entire process of data center design, construction, and operation.

LG Electronics announced that it is participating in “Data Centre World Asia (DCWA) 2026,” Asia’s largest data center exhibition, which opened in Singapore on the 29th, and is showcasing a total solution that covers heat management, power, and operations for AI data centers.

The newly exhibited “Hydronic Modular” is a product that bundles pumps, valves, emergency buffer tanks, and other equipment required for cooling into a single unit. Because the pumps and piping are pre-fabricated as a finished product inside an ISO standard container, the cooling system can be operated immediately at AI data center sites simply by connecting the chiller body and the container module. Previously, to send chilled water produced by the chiller to the server room, pumps and piping had to be welded and assembled, which required substantial time and cost.

This approach reduces both AI data center construction time and initial investment burden, while also enabling a swift response to future AI server expansion needs. Standardized modules can be added and connected as needed, allowing data centers to be expanded in line with planned capacity.

Alongside this, LG Electronics is also presenting an air-cooled, oil-free inverter turbo chiller and a Fan Wall Unit (FWU). The turbo chiller uses an oil-free compressor based on magnetic bearings to reduce friction losses and enhance cooling efficiency. It also incorporates a “refrigerant free-cooling” technology that stops the compressor when the outside air is cold and naturally circulates condensed refrigerant to dissipate heat, thereby reducing energy consumption. The FWU is equipment that supplies cold air within the data center and expels heat. It supports stable server operation by providing uniform cooling performance even in high-heat-load environments.

In the liquid cooling segment, the company has built a CDU (Coolant Distribution Unit) lineup ranging from 600 kW to various megawatt (MW) capacities, and is exhibiting 1 MW and 2.6 MW models at this event. The CDU is a core facility of the direct-to-chip (DTC) cooling method, which circulates coolant through cold plates attached to the GPUs (graphics processing units) and CPUs (central processing units) of high-density AI servers to remove heat from the chips.

These products have recently received NVIDIA quality certification. In July, LG Electronics became the first Korean company to obtain NVIDIA quality certification with its 600 kW-class CDU, and the 1 MW model was approved this month. On the 22nd, the 2.5 MW-class CDU was approved by NVIDIA as a “DSX Ready CDU.” LG Electronics is targeting the start of CDU order intake within this year.

LG Electronics is also developing an immersion cooling solution that cools data center servers by submerging them directly in a special non-conductive cooling fluid. From chillers that generate large volumes of cold water to CDUs that distribute the coolant, and cold plates that directly absorb heat from chips where heat is generated, the company plans to continuously expand its portfolio into a “Chip to Chiller” total solution that covers the entire AI data center thermal management cycle.

At this exhibition, LG Electronics has also set up a “One LG” booth in collaboration with other LG Group affiliates. By jointly proposing ▲LG Electronics’ cooling technologies ▲LG Energy Solution’s battery solutions ▲LG CNS’s capabilities in data center design, construction, and operation, the company intends to play a core AI infrastructure partner role across all areas, from data center design, manufacturing, transportation, and construction to operation and expansion.

Jae-sung Lee, president and head of LG Electronics’ ES Business Division, said, “By leveraging total cooling solutions optimized for hyperscale AI data centers, LG Electronics will advance as a key partner in the global AI infrastructure market.”

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