LG Innotek is partnering with NVIDIA to develop sensing technologies for physical artificial intelligence (AI) devices such as robots and autonomous vehicles. The company plans to expand its penetration of the global robotics market by introducing camera and sensor solutions that incorporate NVIDIA’s latest technologies.

LG Innotek announced on the 22nd that it unveiled sensing solutions using the latest Holoscan Sensor Bridge (HSB) technology at NVIDIA’s technology conference “GTC Berlin,” held in Berlin, Germany, on the 20th (local time). The solutions include a 3‑megapixel camera module and a multimodal vision system (MVS) that combines multiple cameras and sensors.

NVIDIA’s HSB is a technology that transmits data collected by cameras and sensors directly to an AI computer without passing through a central processing unit (CPU). It effectively opens up a data “highway,” enabling robots and autonomous vehicles to recognize and interpret their surroundings more rapidly.

The two companies plan to broaden their collaboration to include vision sensing that serves as the “eyes” of humanoid robots and sensing solutions related to robot hands. They aim to develop sensing solutions that connect to NVIDIA’s next-generation platforms and unveil them at CES 2027, the world’s largest information technology (IT) and home appliance exhibition, as well as at GTC next year.

LG Innotek has recently been expanding its business into the autonomous driving sector. Last year, it formed a strategic partnership with U.S. LiDAR company Aeva, and this year it began joint development of autonomous driving solutions with Applied Intuition and Kakao Mobility. In the robotics field, it is developing robot components with Boston Dynamics and has also started mass production of camera modules for North American robotics customers.

Moon Hyuk-soo, CEO of LG Innotek, said, “Based on our business portfolio that spans not only sensing but also communication modules and semiconductor substrates, we will move quickly to secure a leading position in the physical AI solutions market.”

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