Groundbreaking for SK hynix’s semiconductor plant (fab) in Indiana, United States, is scheduled to be held on the 27th (local time). Key executives, including SK hynix CEO Kwak Noh-jung, are expected to attend the ceremony.

According to the semiconductor industry on the 13th, the groundbreaking ceremony for the state-of-the-art semiconductor packaging plant that SK hynix is pushing to build in West Lafayette, Indiana, will take place on the 27th. SK hynix is reported to have sent invitations to major customers and partner companies ahead of the event.

Key SK Group management, including CEO Kwak, as well as political and business figures from the United States, are also expected to attend. Attention is focusing on whether Chey Tae-won, chairman of SK Group, and Jensen Huang, CEO of Nvidia, a major client of SK hynix, will meet again at this groundbreaking ceremony.

In 2024, SK hynix signed an investment agreement with the state of Indiana to build an advanced semiconductor packaging plant by investing approximately USD 3.87 billion (about KRW 5.5043 trillion). Under the CHIPS and Science Act, the U.S. government has decided to provide up to USD 450 million (about KRW 640 billion) in direct subsidies and loans totaling USD 500 million (about KRW 711.2 billion). The plant will be SK hynix’s first high bandwidth memory (HBM) packaging production base in the United States and is expected to produce 7th-generation HBM (HBM4E) and 8th-generation HBM (HBM5). The goal is to begin mass production in the second half (July–December) of 2028.

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