Samsung Electro-Mechanics and LG Innotek have successively unveiled next-generation semiconductor substrate technologies targeting the artificial intelligence (AI) market.

Samsung Electro-Mechanics announced on the 9th that it participated in the “KPCA Show 2026” (Korea Printed Circuit Association Show, International Semiconductor Substrate and Advanced Packaging Industry Exhibition) held at Songdo Convensia in Incheon and introduced its latest substrate technologies, including 2.5-dimensional (D) package substrates and glass substrates. The 2.5D package substrate is a high-performance substrate with durability and signal transmission speed capable of withstanding changes such as larger semiconductor sizes (large-area) and increased stacking height (high multilayer). The glass substrate uses glass material to reduce warpage of the substrate and improve power efficiency.

LG Innotek unveiled for the first time its flip chip ball grid array (FC-BGA) for AI semiconductors. FC-BGA is a high-performance semiconductor package substrate that connects semiconductor chips to the mainboard. LG Innotek stated, “The FC-BGA for AI semiconductors being unveiled this time is a large-area substrate with each side measuring over 100 mm, into which the core technologies accumulated by LG Innotek over the past 50 years have been integrated.” LG Innotek aims to begin mass production of high value-added FC-BGA in 2027.

Marking its 23rd edition this year, the KPCA Show is the largest domestic exhibition specializing in printed circuit boards (PCBs) and semiconductor packaging. This year’s event, held from the 9th to the 11th, features participation from more than 350 domestic and overseas companies sharing the latest technologies and trends.

Popular News