HUNETPLUS, a next-generation semiconductor and display materials company led by CEO Cha Hyuk-jin, announced on the 13th that it has secured Pre-Series B investment for its U.S. expansion. This investment includes participation from global semiconductor companies such as Japan's Company A, Taiwan's Company B, and Korea's Anda Asia Ventures.

This investment is significant as it represents a strategic collaboration among Korea, Japan, and Taiwan at a time when semiconductor tariff issues are becoming prominent. HUNETPLUS plans to reduce tariff burdens and strengthen global marketing based on its global patent and technological prowess in ML-EUV® (Molecular Layer Assembled Extreme UltraViolet).

The ML-EUV® technology has achieved ultra-high resolution below 10nm and line edge roughness (LER) below 2nm, which were difficult to implement in existing chemical amplification (2nd generation), inorganic nanocluster (3rd generation), and inorganic dry (4th generation) processes. It is an innovative method that forms ultra-multilayer thin films of 10-20nm using a dry molecular layer deposition process with organic-inorganic monomers.

With this investment, HUNETPLUS will accelerate the commercialization of ML-EUV®. The company plans to jointly develop and commercialize dry process equipment and processes with leading semiconductor equipment companies and strengthen its core material supply chain in collaboration with global material companies.

CEO Cha Hyuk-jin stated, “The global semiconductor market is in an era where borders are meaningless. Global companies must collaborate around innovative technologies and products to build a sustainable ecosystem. Following this investment, we will secure additional investments in the U.S. and create a unique ecosystem with local partners.”

Advisory Board Member Kim Hae-sun commented, “Having passed a rigorous two-year due diligence by global companies, our technological prowess has been recognized. This investment will become a successful case of global scale-up for HUNETPLUS.”

Nam-hoon Cho, CEO of K-Ground Ventures, remarked, “Investing in fundamental technology is a significant decision, but we trusted HUNETPLUS's R&D capabilities. The long-term strategy, from initial investment through the Hongneung Advanced Science and Technology Commercialization Fund to follow-up and reinvestment, and scale-up TIPS support, has borne fruit. This joint investment will lead to Korea-U.S. joint R&D, production, and global marketing.”

He also emphasized, “For Korean startups to secure IP, R&D, and marketing competitiveness in the global market, the establishment of large-scale advanced science and technology commercialization and IP funds by the government and a long-term scale-up strategy are essential.”

Meanwhile, U.S. President Donald Trump announced on the 6th at Apple's U.S. facility investment announcement event that “a 100% tariff will be imposed on all semiconductors imported into the U.S.,” drawing attention from the semiconductor industry and investors, who are focusing on the results of the Korea-U.S. summit due to the high proportion of semiconductor exports to the U.S.

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